Beat 01
Baseline measurement template
How to capture the pre-pilot number so the result is defensible to your own leadership.
Resources
Briefs, benchmarks and templates
Material to help you scope a pilot, run the internal case and get through the IT/OT review without a dozen meetings.
- Briefs
- Templates
- Benchmarks
- Webinars
Briefs
Technical and commercial briefs
Closed-loop control in display manufacturing
The architecture brief for process and yield engineering
Security and process-IP protection
For IT/OT and IP review teams, including air-gapped deployment
Mura false-call reduction methodology
How to measure suppression without hiding escapes
microLED transfer-yield economics
Cost per good panel and where repair effort should go
Templates
Reusable scoping material
Beat 02
Pilot scope template
Workflow, tools, metric, timeline and conversion terms on one page.
Beat 03
IT/OT review checklist
The questions your security team will ask, with where each answer lives.
Beat 04
Internal business-case outline
Structure for the paper you will have to write anyway.
# closed loop, one panel
perceive substrate → tft → emitter stack → sub-pixel
plan deposition · anneal · transfer · test/bin
act recipe write-back (SECS-GEM)
sense mura ΔL* · sub-pixel opens · particles
optimise yield · ramp · scrap
log immutable audit entry ✓ signed
retrain engineer correction → model
Evaluation
A six-step evaluation you can run yourself
You do not need us in the room for most of this.
Step 1 of 6 · identify
Identify the loss
Pick the number already on a weekly report.
Step 2 of 6 · baseline
Baseline it properly
A full production period, documented method.
Step 3 of 6 · scope
Scope the tools
Which tools and interfaces are actually in play.
Step 4 of 6 · govern
Check governance
Who approves a connector and a write-back path.
Step 5 of 6 · metric
Agree the metric
One metric, one owner, one decision date.
Step 6 of 6 · decide
Decide
On the number, not on the demo.
Formats
What is available
Technical briefs
Architecture, perception, control and audit, written for engineers.
Commercial briefs
Pricing logic, ROI structure and expansion mechanics.
Templates
Baseline, pilot scope, IT/OT checklist and business-case outline.
Benchmarks
Measurement methodology for false calls, uniformity and ramp.
Webinars
Working sessions with process and yield engineers, not product pitches.
Documentation
The full deployment and operations guides.
Benchmarks
How we recommend measuring
Adopt these whether or not you evaluate Emiteon — they make any vendor comparison honest.
| Metric | Definition | Paired guard metric |
|---|---|---|
| False-call rate | Calls dispositioned as non-defects / total calls | Escape rate |
| In-window rate | Panels produced inside the uniformity window | Rework rate |
| Transfer yield | Good emitters placed and bonded / attempted | Repair cycles per panel |
| Ramp time | Weeks from first production run to target yield | Scrap during ramp |
| Recovered value | Realised value per panel after binning | Warranty return rate |
Webinars
Working sessions, not pitches
Each session takes one workflow, walks the measurement method, and takes questions from engineers who will try to break the argument. Recordings are shared with attendees.
- Mura false-call measurement without hiding escapes
- Designing write-back that equipment engineering approves
- Baselining a ramp so improvement is provable
- Air-gapped deployment in practice
# closed loop, one panel
perceive substrate → tft → emitter stack → sub-pixel
plan deposition · anneal · transfer · test/bin
act recipe write-back (SECS-GEM)
sense mura ΔL* · sub-pixel opens · particles
optimise yield · ramp · scrap
log immutable audit entry ✓ signed
retrain engineer correction → model
Request
Ask for a specific brief
Tell us which brief or template you need and where you are in the evaluation.
- Shadow-mode instrumentation on one wedge workflow
- Baseline measurement of yield, false calls and ramp time
- Paid pilot with a single agreed success metric
Voices from the line
What the fab floor tells us
“We do not lose panels because nobody is watching. We lose them because the signal that mattered was buried under a thousand nuisance calls.”
“Ramp is the whole game. If a new product takes two quarters of manual tuning, that is two quarters of margin we never get back.”
“Transfer yield is our ceiling on microLED. Every dead emitter is a repair cycle or a scrapped backplane.”
Quotes are illustrative composites drawn from discovery interviews with process-integration, yield and quality engineers. Named references are [PLACEHOLDER] pending design-partner consent.
The economics
What the loop is measured on
Emiteon is priced and evaluated on the numbers a fab already reports. These are design-partner targets for the first twelve months of deployment.
$26BDisplay-fab automation, process control, inspection, test and fab software market
~14%Annual growth in the segments Emiteon plays in
135%Net revenue retention target from land-and-expand
99.9%Uptime target for the fab edge runtime
Figures marked as targets are design-partner objectives, not audited results. Company operating status, customers and outcomes are [ASPIRATIONAL] until independently verified.
FAQ
Questions fabs ask first
Through three gates. Shadow mode observes and predicts with no write-back; advisory mode recommends recipe, transfer and binning moves that a process-integration or yield engineer approves; graduated autonomy releases low-risk deposition, anneal and transfer control once measured accuracy and twin validation clear the bar. High-impact decisions stay human-in-the-loop.
Reducing false calls is the wedge, not a side effect. The mura-and-defect agent is trained on true-versus-false-call labels from your own inspection history, so it separates genuine large-area non-uniformity, sub-pixel opens and shorts, particles and stains from nuisance signals, and every call is traceable to the evidence behind it.
Per-tenant isolation with recipes, panel designs and defect images scoped to your tenant, encryption in transit and at rest, SSO/RBAC, an immutable yield/quality-grade audit log and an on-prem or air-gapped option. Fleet learning shares model improvements, never your recipes.
Deposition, photolithography, encapsulation and anneal tools, Mura/AOI inspection and metrology, array and cell test, mass-transfer and repair stations, robotic handling and MES — vendor-neutral via SECS-GEM/HSMS where the tool supports it, with REST and OPC-UA bridges elsewhere.
Every pixel, perfectly uniform.
Take the material and run the evaluation
If it leads you somewhere other than us, at least the method was sound.